Scientific Contributions
Showing entries 501 - 520 out of 675
Interactions between Sn-based Solders and Ni(P)-Substrates: The Ni-P-Sn Phase Diagram
Herbert Ipser
13. Österreichische Chemietage (GÖCH 2009)
Conference,
Talk or oral contribution
25.8.2009 - 25.8.2009
Phase-Equilibria and Structural Investigations in the System Al-Fe-Si
Martin Marker
13. Österreichische Chemietage (GÖCH 2009)
Conference,
Talk or oral contribution
24.8.2009 - 24.8.2009
Phase-Equilibria and Structural Investigations in the System Al-Fe-Si
Klaus Richter
13. Österreichische Chemietage (GÖCH 2009)
Conference,
Talk or oral contribution
24.8.2009 - 24.8.2009
Phase Diagrams in Lead-free Soldering
Clemens Schmetterer
Talk or oral contribution
2.7.2009 - 2.7.2009
Phase Diagrams in Lead-free Soldering
Hans Flandorfer
Talk or oral contribution
2.7.2009 - 2.7.2009
Phase Diagrams in Lead-free Soldering
Herbert Ipser
Talk or oral contribution
2.7.2009 - 2.7.2009
Strukturbeziehungen fester und flüssiger Legierungen
Hans Flandorfer
Talk or oral contribution
29.6.2009 - 29.6.2009
Experimental data for CALPHAD
Hans Flandorfer
CALPHAD 38
Conference,
Talk or oral contribution
19.5.2009 - 19.5.2009
On the prediction of site prefernces in structurally complex compounds
Klaus Richter
CALPHAD 38
Conference,
Talk or oral contribution
18.5.2009 - 18.5.2009
Lead-free Soldering: Thermodynamic Properties and Phase Equilibria of Relevant Alloy Systems
Herbert Ipser
Talk or oral contribution
15.5.2009 - 15.5.2009
The Ni-P-Sn Phase Diagram
Clemens Schmetterer
Talk or oral contribution
15.4.2009 - 15.4.2009
Investigation of various properties of lead free solders (Ag-Au-Sn, Au-Sb-Sn, Sn-Au-Cu, Ag-Bi-Sn)
Michael Hindler
TMS 2009 Annual Meeting and Exhibition
Conference,
Talk or oral contribution
16.2.2009 - 16.2.2009
Investigation of various properties of lead free solders (Ag-Au-Sn, Au-Sb-Sn, Sn-Au-Cu, Ag-Bi-Sn)
Sabine Knott
TMS 2009 Annual Meeting and Exhibition
Conference,
Talk or oral contribution
16.2.2009 - 16.2.2009
Investigation of various properties of lead free solders (Ag-Au-Sn, Au-Sb-Sn, Sn-Au-Cu, Ag-Bi-Sn)
Clemens Schmetterer
TMS 2009 Annual Meeting and Exhibition
Conference,
Talk or oral contribution
16.2.2009 - 16.2.2009
Investigation of various properties of lead free solders (Ag-Au-Sn, Au-Sb-Sn, Sn-Au-Cu, Ag-Bi-Sn)
Adolf Mikula
TMS 2009 Annual Meeting and Exhibition
Conference,
Talk or oral contribution
16.2.2009 - 16.2.2009
Phase Equilibria for Understanding the Reaction between Sn-based Solders and Ni(P) Substrates
Clemens Schmetterer
TMS 2009 Annual Meeting and Exhibition
Conference,
Talk or oral contribution
15.2.2009 - 15.2.2009
Phase Equilibria for Understanding the Reaction between Sn-based Solders and Ni(P) Substrates
Herbert Ipser
TMS 2009 Annual Meeting and Exhibition
Conference,
Talk or oral contribution
15.2.2009 - 15.2.2009
Solidification Behavior of Cu-Ni-Sn
Herbert Ipser
TMS 2009 Annual Meeting and Exhibition
Conference,
Talk or oral contribution
15.2.2009 - 15.2.2009
Showing entries 501 - 520 out of 675